Intermetalliccompound相关论文
Although most transition metals have been tested as the promoter to Pt for electrocatalysis toward fuel cell reactions, ......
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Interfacial Characterization and Mechanical Property of Ti/Cu Clad Sheet Produced by Explosive Weldi
It was aim to investigate the interfacial microstructure and shear performance of Ti/Cu clad sheet produced by explosive......
Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during So
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IM......
The formation and growth behavior of intermetallic compound (IMC) layers after introducing an electroless Ni-W-P metalli......
Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal
The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth b......
The microstructure and hardness of conventionally solidified Ni-xSi (x=21.4, 22, 24, 26) alloys were investigated.The so......
通过第一性原理计算的方法研究了Mn2 CoZ金属间化合物在不同原子排列状态下的能带结构和磁性.结果表明如果Mn2 CoZ金属间化合物晶......
Magnetic and magnetocaloric properties of HoFe1-xCoxAl(x=0,0.3)were investigated.Both HoFeAl and HoFe0.7Co0.3Al undergo ......
通过激光熔化沉积技术,在Ti-6Al-4V(TC4)基材表面原位合成了NiTi基金属间化合物涂层,并研究了其微结构特征、显微硬度和电化学腐蚀......
对DP980板和A6061板进行了激光搭接焊试验，对比分析了镍箔对焊接接头焊缝(WS)和熔合线(FL)的显微组织、显微硬度及拉剪性能的影响。......
Microstructural Evolution and Mechanical Properties of Laminated CuAl Composites Processed by Accumu
Nano structured Cu-/Al-laminated composites were processed by accumulative roll-bonding(ARB)technique for four cycles.Mi......
Intermetallic compounds based on rare-earth metals and iron are by far the most promising materials for permanent magnet......
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5
Currently,in the era of big data and 5G communication technology,electromigration has become a seri-ous reliability issu......
A data-driven approach combining together the experimental laser soldering,finite element analysis and machine learning,......
本文对电子元器件引线贮存一定时间后，可焊性下降的原因进行研究。采用数理统计方法，得出不同铋、锑含量的６０焊锡镀层与铜基体间金属间......
利用金相显微镜及扫描电镜,对铝合金上等离子喷涂的Ni、Ni/Al、Ni/Cr/Al、NiCrAlCoY-TiAl3和NiCrAlCoY-AlNi涂层的界面进行热震前......
